1. When to use 3D die-stacking for bandwidth-constrained big data workloads

    Sat 02 April 2016 | tags: Papers

    3D die-stacking is an exciting emerging technology. It promises extremely high bandwidth interconnects for relatively power (at least when compared to current memory technology). Some of my previous work has looked at how this increased bandwidth can significantly improve performance. This is especially true for bandwidth-constrained workloads, like database scan …

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